1. 2. 3. material content data sheet sales product name tle7236em issued 28. august 2013 ma# MA000982092 package pg-ssop-24-4 weight* 150.92 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.306 2.85 2.85 28530 28530 leadframe inorganic material phosphorus 7723-14-0 0.017 0.01 111 non noble metal zinc 7440-66-6 0.067 0.04 446 non noble metal iron 7439-89-6 1.345 0.89 8913 non noble metal copper 7440-50-8 54.617 36.19 37.13 361885 371355 wire noble metal gold 7440-57-5 0.572 0.38 0.38 3788 3788 encapsulation organic material carbon black 1333-86-4 0.171 0.11 1135 plastics epoxy resin - 7.880 5.22 52212 inorganic material silicondioxide 60676-86-0 77.600 51.42 56.75 514170 567517 leadfinish non noble metal tin 7440-31-5 2.911 1.93 1.93 19287 19287 plating noble metal silver 7440-22-4 0.234 0.16 0.16 1552 1552 glue plastics epoxy resin - 0.301 0.20 1993 noble metal silver 7440-22-4 0.902 0.60 0.80 5978 7971 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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